DesignCon is my chance to see in person old friends and colleagues and meet new ones whom I have only met through email or online. Please come find me at DesignCon and be sure to introduce yourself and say Hey!
Here is my tentative schedule:
Tuesday: 4:45 – 6 pm, Ballroom G, Panel presentation from the IEEE 370 Working Group,
BRIEFING FROM THE IEEE P370WORKING GROUP: ELECTRICAL CHARACTERIZATION OF PCBS AND RELATED INTERCONNECTS AT FREQUENCIES UP TO 50 GHZ
Wed 10-10:45, Ballroom D, My graduate student, Tim Wang Lee, will present our paper, developed with Yuriy Shlepnev, BACK TO BASICS: THE ONSET OF SKINEFFECT IN CIRCUIT BOARD TRACES
Wed 11-11:45, Ballroom C, I will present the paper, A NEW CHARACTERIZATION TECHNIQUE FOR GLASS WEAVE SKEW (PART 2), along with my graduate student and Bill Hargin and distinguished colleagues from Cisco.
Wed 3-3:45, Chiphead Theater, I will be listening to my colleagues from Teledyne LeCroy, Ken Johnson and Pete Pupalaikis, talk about DIGITAL POWER MANAGEMENT AND POWER INTEGRITY ANALYSIS AND TESTING.
Thurs 9-9:45, Ballroom G, I will be listening to my Teledyne LeCroy colleague, Pete Pupalaikis, present, THE FASTEST PAM4 SIGNAL EVER GENERATED. It is an astounding 380 Gbps!
Thurs 11-11:45, Ballroom G, I will be listening to two of my goto experts in the field of SI/PI, Pete Pupalaikis and Istvan Novak present, A GENERIC TEST TOOL FOR POWER DISTRIBUTION NETWORKS.
Thurs 2-2:45, Ballroom D, I will be listening to my colleague, Pete Pupalaikis, talk about, UNDERSTANDING VERTICAL RESOLUTION IN OSCILLOSCOPES.
Thurs 3-3:45, Chiphead Theater, I will participate on a panel with the three most recent Engineers of the Year on a free wheeling discussion on the issues in our industry today.
In addition, I plan to hang out at the Teledyne LeCroy booth, 733 and the Signal Integrity Journal booth, T2. (as a special treat, Susan will be at the Signal Integrity Journal Booth on Wed and Thurs from 1 to 3. She’d love to see you! Stop by)
Be sure to stop by and say Hey!